Method of manufacturing a circuit board with light emitting diodes
US8307547B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 16, 2012 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jan 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit board (PCB) with light emitting diodes includes a channel through the PCB to define first and second sides diametrically opposed from each other, a plurality of first legs from the first side towards the second side, and a plurality of second legs from the second side towards the first side, and alternating across the PCB from the first side to the second side the plurality of legs. The channel thus runs along top and bottom edges defined between a pair of adjacent first and second legs. Bridges are provided along the channel physically connecting the first side to the second legs, and/or connecting the second side to the first legs, and/or connecting between the first and second legs. Lastly, LEDs are populated along the sides and legs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.