Glass substrate processing method and glass component
US8307672B2 · kind B2 · utility
19Cited by
10References
14Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 22, 2006 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jul 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A glass substrate processing method includes irradiating laser light L onto a glass substrate 1 such that the laser light L is focused within the glass substrate 1, thereby forming a high density area 3 that has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and performing chemical etching on the glass substrate 1 using an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projection 2 on a surface 1a of the glass substrate 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.