Hot-melt sealing glass compositions and methods of making and using the same
US8307674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jul 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16235
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.