Wire bonding method
US8308049B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | May 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.