Printhead assembly incorporating plural printhead integrated circuits sealed to support member with polymer sealing film
US8308273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jul 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A pagewidth printhead assembly includes a plurality of printhead integrated circuits linked end to end across a width of the pagewidth printhead assembly; a support molding to which the plurality of printhead integrated circuits are sealed, the support molding defining a plurality of ink channels; a plurality of etched channels provided on an underside of each printhead integrated circuit, each etched channel defining along a length thereof a plurality of ink inlets for receiving ink from one of the plurality of ink channels; and a polymer sealing film for sealing the printhead integrated circuits to the support molding, the polymer sealing film defining therethrough a plurality of openings. Each of the plurality of etched channels is divided into two or more separate channel sections separated by respective channel wall structures. Each opening of the polymer film is in fluid communication with ink inlets of two separate channel sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.