Nano-oxide process for bonding copper/copper alloy and resin
US8308893B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Feb 1, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.