Systems and methods for magnetron deposition
US8308915B2 · kind B2 · utility
1Cited by
144References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2006 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Mar 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3452
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for face target sputtering to fabricate semiconductors by providing one or more materials with differential coefficients of expansion in the FTS chamber; and generating a controlled pressure and size with the one or more materials during sintering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.