Planarization method for media
US8308964B2 · kind B2 · utility
10Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | May 7, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44D3/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A planarization process may planarize a media disk that has data trenches between data features and larger servo trenches between servo features. A filler material layer is deposited on the media disk and provides step coverage of the trenches. The filler material has data recesses over the data trenches and servo recesses over the servo trenches that must be removed to produce a planar media surface. A first planarization process is used to remove the data recesses and a second planarization process is used to remove the servo recesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.