Compositions and methods for removing organic substances
US8309502B2 · kind B2 · utility
12Cited by
89References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 2, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Nov 12, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.