Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same
US8309636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2011 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jun 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12396
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.