High dielectric constant laser direct structuring materials
US8309640B2 · kind B2 · utility
37Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2009 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | May 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.