Patent · US Active

Polyamide moulding compound and use thereof

US8309643B2 · kind B2 · utility

18Cited by
6References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 4, 2010
Grant dateNov 13, 2012
Priority date
Expiry dateAug 4, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/1372
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The present invention relates to polyamide moulding compounds which have very low distortion with good mechanical properties. This is achieved by a combination of transparent polyamide with fibrous reinforcing materials and also particulate fillers. The moulding compounds according to the invention are used for the production of any moulded articles, semi-finished products or finished products.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.