Polyamide moulding compound and use thereof
US8309643B2 · kind B2 · utility
18Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Aug 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1372
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to polyamide moulding compounds which have very low distortion with good mechanical properties. This is achieved by a combination of transparent polyamide with fibrous reinforcing materials and also particulate fillers. The moulding compounds according to the invention are used for the production of any moulded articles, semi-finished products or finished products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.