Replacement of scribeline padframe with saw-friendly design
US8309957B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05093
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit substrate containing an electrical probe pad structure over, and on both sides of, a dicing kerf lane. The electrical probe pad structure includes metal crack arresting strips adjacent to the dicing kerf lane. A metal density between the crack arresting strips is less than 70 percent. An electrical probe pad structure containing metal crack arresting strips, with a metal density between the crack arresting strips less than 70 percent. A process of forming an integrated circuit by forming an electrical probe pad structure over a dicing kerf lane adjacent to the integrated circuit, such that the electrical probe pad structure has metal crack arresting strips adjacent to the dicing kerf lane, and performing a dicing operation through the electrical probe pad structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.