Patent · US Active

Silicon-based sub-mount for an opto-electronic device

US8309973B2 · kind B2 · utility

0Cited by

4References

18Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Jochen Kuhmann · Berlin, DE
Heike Huscher · Berlin, DE

Key dates

Filing date	Feb 12, 2009
Grant date	Nov 13, 2012
Priority date	—
Expiry date	Feb 12, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 μm-700 μm. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.