Light emitting diode package
US8309974B2 · kind B2 · utility
6Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate.A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO2, from 13 to 18% of B2O3, from 9 to 23% of CaO, from 3 to 8% of Al2O3 and from 0.5 to 6% of at least one of K2O and Na2O in total, and a ceramic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.