LED module with color conversion layer designed for a homogenous color distribution

US8309981B2 · kind B2 · utility

Assignee

• Ledon Lighting Jennersdorf GmbH · AT

Inventors

• Christian Sommer · Nussbaumen, CH
• Franz Wenzl · Augsburg, DE
• Peter Pachler · Graz, AT
• Paul R. Hartmann · Escondido, US

Key dates

• Filing date: Apr 18, 2008
• Grant date: Nov 13, 2012
• Expiry date: May 31, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8514

Abstract

An LED module having an LED semiconductor chip mounted directly or indirectly on a platform. The platform is made from silicon and is extends laterally beyond the LED semiconductor chip having an active light emitting layer and a substrate. At least one electronic component that is part of the control circuitry for the LED semiconductor chip is integrated in the silicon platform.