TCP-type semiconductor device
US8310068B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 7, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Aug 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A TCP type semiconductor device, which is connected to a plurality of substrate-side electrodes parallel to each other and each having a linear shape, has: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film and electrically connecting between the semiconductor chip and the plurality of substrate-side electrodes, respectively. Each of the plurality of leads has an external terminal section extending in a first direction and configured to come in contact with corresponding one of the plurality of substrate-side electrodes. A part of the external terminal section is a wide section that is formed wider than the other section of the external terminal section A position of the wide section in the first direction is different between adjacent leads of the plurality of leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.