Electronic circuit-integrated motor drive and semiconductor module
US8310121B2 · kind B2 · utility
24Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Dec 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A motor case is formed in a tubular shape. A semiconductor module includes a semiconductor chip of switching elements, a resin part and a coil terminal. The resin part embeds the semiconductor chip therein. The coil terminal is protruded from the resin part and directly connected to a coil. A connection part between the coil terminal and the coil is arranged at a position, which is between a top wall surface and a bottom wall surface of the resin part facing each other in the axial direction of a motor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.