Protective film forming method
US8310788B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 10, 2008 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Aug 8, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/6082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide a high-quality protection target by forming a protective film that is thin and excellent in corrosion resistance. Provided is a protective film forming method for forming a protective film at least on a surface of a protection target. The method comprises: a base film forming step for forming a base film on the surface of the protection target; and a DLC film forming step for forming a diamond-like carbon film on the base film. The base film forming step forms the base film on the surface of the protection target for a plurality of times by repeating a process of depositing the base film in a prescribed thickness and eliminating a part of or a whole part of the base film. Further, the method comprises, before the DLC film forming step, an insulating layer forming step for forming an insulating layer on the surface of the base film on which the diamond-like carbon film is to be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.