Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication device
US8311375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2010 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Jan 5, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic wiring board includes a flex-rigid substrate and an optical communication unit. The flex-rigid substrate includes a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each include a lamination formed of a conductive circuit and an insulating layer. The optical communication unit is made of a flexible material and has both end faces substantially perpendicular to its optical path of transmitting light. Both end portions of the optical communication unit are disposed and fixed on the rigid sections so that both end faces of the optical communication unit face an optical element mounting region provided on the rigid sections of the flex-rigid substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.