Methods and apparatuses for dynamic probe adjustment
US8311758B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2006 |
| Grant date | Nov 13, 2012 |
| Priority date | — |
| Expiry date | Apr 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.