Flow-through pressure sensor apparatus
US8312774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Jul 18, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A flow-through pressure sensor apparatus that reduces the dead space of a flow tube utilized to provide fluid communication between a pressure sense die and a fluid and with an absolute minimum trapped volume. A cover (e.g., plastic) with two-molded ports can be added to one side of the pressure sense die utilizing molded-in solder pins to improve ruggedness and rigidity. A temperature and a humidity sensor can also be mounted to a substrate (e.g., ceramic) in the flow path and can be connected to a programmable compensation integrated circuit on the opposite side utilizing a clip end of mounting pins or by vias through the substrate outside a pressurized area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.