Wire dispensing system including wire payoff structure
US8313054B2 · kind B2 · utility
10Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2701/36
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A wire payoff structure includes a plurality of arm members, a first ring, a second ring, and a third ring. The first ring is coupled with each of the arm members. The second ring is coupled with each of the arm members and is spaced radially outwardly from the first ring. The third ring is coupled with each of the arm members and is spaced radially outwardly from the second ring. A portion of each arm member passes beneath the third ring to facilitate contact with an underlying wire stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.