Compact air-plus-liquid thermal management module
US8313282B1 · kind B1 · utility
7Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Mar 20, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04D25/0613
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a compact and integrated fan, pump, and heat exchanger system where air-cooling is performed via the fan, liquid cooling is performed via a pump, and heat exchange fins in thermal contact with a fluid channel act as a heat exchanger. Heated fluid is carried inside the fluid channel, where heat therein is conducted to the fins. The air flows around the outside surfaces of the fins so that the heat transfers from the heated fluid into the air stream.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.