Insulation paper with high thermal conductivity materials
US8313832B2 · kind B2 · utility
1Cited by
76References
16Claims
0Family size
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Key dates
| Filing date | Jul 16, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Jul 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.