Printed circuits and method for making same
US8313891B2 · kind B2 · utility
2Cited by
14References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Jul 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.