Chip card, and method for the production thereof
US8313981B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 14, 2009 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Apr 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip card in the form of an ID-1 card, a plug-in SIM or a USB token has a layered compound with two or three layers extending over the complete chip card. The chip card including an exterior foil layer has on its outward facing front side a communication contact layout and on its back side a flip chip, as well as a flip chip contact layout which is electroconductively connected with the communication contact layout on the front side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.