Flexible thermal energy dissipating and light emitting diode mounting arrangement
US8314433B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | May 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flexible thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a flexible thermally conductive sheet. The thermally conductive sheet defines a plurality of openings therethrough each sized to receive and securely hold therein a different one of the plurality of LEDs with the flexible thermally conductive sheet about the opening in physical, thermally conductive contact with the at least one side portion of the encapsulating material. The flexible thermally conductive sheet absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet. The flexible thermally conductive sheet is formable to direct radiation from the plurality of LEDs in multiple directions while securely holding each of the plurality of LEDs within a corresponding one of each of the plurality of openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.