Method for manufacturing a package-on-package type semiconductor device
US8314493B2 · kind B2 · utility
7Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2010 |
| Grant date | Nov 20, 2012 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.