Heat dissipation device
US8316923B2 · kind B2 · utility
2Cited by
4References
15Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Sep 24, 2009 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Jun 10, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink, a plurality of fasteners extending through the heat sink, a fan holder mounted on the heat sink and a fan secured on the fan holder. The heat sink includes multiple claws to retain the fasteners therein. The fan holder includes a hoop surrounding the heat sink and a bracket supporting the fan. A plurality of sleeves are formed on the hoop and aligned with the claws of the heat sink, to thereby guide a tool to manipulate the fasteners to secure the heat sink to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.