Selective deposition modeling methods for improved support-object interface
US8318076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2010 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Dec 26, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.