Plasma mediated processing of non-conductive substrates
US8318265B2 · kind B2 · utility
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23Claims
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Key dates
| Filing date | Jun 12, 2008 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Sep 28, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/5096
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.