Patent · US Active

Polyoxymethylene molding materials and moldings and the use thereof

US8318866B2 · kind B2 · utility

9Cited by

18References

18Claims

0Family size

Assignee

Ticona LLC · US

Inventors

Klaus Kurz · Kelsterbach, DE
Christine Koestler · Hattersheim, DE
Lowell Larson · Independence, US

Key dates

Filing date	Apr 14, 2009
Grant date	Nov 27, 2012
Priority date	—
Expiry date	Jun 7, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/12
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Molding materials and the moldings produced therefrom, containing a) polyoxymethylene in which at least 50% of the terminal groups are hydroxyl groups, which has a melt volume rate MVR of less than 20 cm3/10 minutes, measured according to ISO 1133 at 190° C. and 2.16 kg, and whose proportion of low molecular weight constituents having low molecular weights below 10 000 dalton is less than 15% by weight, based on the total mass of the polyoxymethylene, and b) a thermoplastic elastomer, are described.The moldings produced from these molding materials are distinguished by a very high notch impact strength.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.