Patent · US Active

Adhesive wafer

US8319003B2 · kind B2 · utility

72Cited by

11References

18Claims

0Family size

Assignee

Coloplast A/S · DK

Inventors

Hans Olsen · Copenhagen, DK
Jakob Oeelund · Ringe, DK
Danuta Ciok

Key dates

Filing date	Apr 19, 2007
Grant date	Nov 27, 2012
Priority date	—
Expiry date	Apr 30, 2029

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61F2013/0077
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

An adhesive wafer for an ostomy faceplate or wound dressing comprising a backing layer, said backing layer having one surface facing the skin, said surface comprising a first and a second adhesive zone being separated from each others by a void volume, said void volume being defined by the backing layer, the first and the second adhesive zones and the skin surface and wherein the first and the second adhesive zones are capable of moving independently of each others with respect to the lateral plane of the backing layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.