Environmental protection coating system and method
US8319112B2 · kind B2 · utility
5Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2009 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Jul 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49982
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.