Micro-electromechanical system devices
US8319254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2011 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Feb 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D18/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micro-electromechanical system (MEMS) device includes a substrate, a first beam, a second beam, and a third beam. The first beam includes first and second portions separated by an isolation joint. The first and second portions each comprise a semiconductor and a first dielectric layer. An electrically conductive trace is mechanically coupled to the first beam and electrically coupled to the second portion's semiconductor but not the first portion's semiconductor. The second beam includes a second dielectric layer. The profile of each of the first second, and third beams has been formed by a dry etch. A cavity separates a surface of the substrate from the first, second, and third beams. The cavity has been formed by a dry etch. A side wall of each of the first, second, and third beams has substantially no dielectric layer disposed thereon, and the dielectric layer has been removed by a vapor-phase etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.