Light emitting diode module having a ground lead
US8319429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2011 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Jan 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.