Multilayer electronic component and method for manufacturing the same
US8320101B2 · kind B2 · utility
3Cited by
15References
2Claims
0Family size
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Key dates
| Filing date | Jun 17, 2010 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Mar 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.