Heat dissipation device with bracket
US8320130B2 · kind B2 · utility
2Cited by
9References
13Claims
0Family size
Assignees
Inventor
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Nov 27, 2012 |
| Priority date | — |
| Expiry date | Feb 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary heat dissipation device includes a base plate, a bracket engaged with the base plate, and a heat radiator mounted on the base plate and the bracket. The bracket includes two parallel arms. The bracket defines an opening between the arms. Each of the arms extends downwardly two clasps. Each clasp of each arm comprises a blocking part and a connecting part connecting the blocking part. The base plate is received into the opening of the bracket and sandwiched and secured by the blocking parts of the clasps and the arms of the bracket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.