Sensor package assembly having an unconstrained sense die
US8322225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jun 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure detection mechanism having a pressure sense die which may be attached directly to a surface of an alumina-based substrate with an adhesive having an optimum thickness. The adhesive may be stress compliant and may be one or more of silicone, silicone-epoxy, epoxy or any other suitable adhesive material. A compensation and interface application specific integrated circuit may be attached to the surface of the package substrate. The pressure sense die may be electrically connected to the integrated circuit with bond wires. The integrated circuit may be electrically connected to trace conductors on the package substrate with bond wires, and trace conductors may be connected to stress compliant metal conductors or leads for external connection to a mounting surface such as a printed circuit board. Hard plastic, or like material, symmetric covers, with one or more pressure ports or vents, may be attached to both sides of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.