Patent · US Active

Partially aromatic moulding compositions and their uses

US8324297B2 · kind B2 · utility

5Cited by
3References
41Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 26, 2011
Grant dateDec 4, 2012
Priority date—
Expiry dateJan 26, 2031

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K7/14
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Polyamide molding composition, in particular for use for components of electronic and/or electrical components, having the following composition:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.