Patent · US Active

High-temperature polyamide molding compounds reinforced with flat glass fibers

US8324307B2 · kind B2 · utility

52Cited by
2References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 25, 2008
Grant dateDec 4, 2012
Priority date
Expiry dateOct 18, 2030

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/16
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.