High-temperature polyamide molding compounds reinforced with flat glass fibers
US8324307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2008 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Oct 18, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to reinforced polyamide molding compounds containing high-melting partially aromatic polyamides and flat glass fibers, in particular with a rectangular cross section, i.e., glass fibers with a noncircular cross-sectional area and a dimension ratio of the main cross-sectional axis to the secondary cross-sectional axis of 2 to 6, in particular 3 to 6, most especially preferably from 3.5 to 5.0. The present invention also relates to a method for manufacturing polyamide molding compounds and molded articles manufactured therefrom, i.e., in particular injection-molded parts. The inventive molded parts have a high transverse stiffness and transverse strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.