Resin for thermal imprint
US8324332B2 · kind B2 · utility
1Cited by
1References
4Claims
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Key dates
| Filing date | Aug 25, 2006 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Sep 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0108
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin for thermal imprint including a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved.Tg (° C.)<219×log [M]−104 [Equation 1]
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.