Digital envelope modulator for haptic feedback devices
US8325144B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2007 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Mar 4, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A haptic feedback device includes a signal generation module configured to output a composite signal representable by a carrier signal and an envelope signal. The signal generation module includes a microcontroller capable of being programmed such that the carrier signal falls within a resonance frequency band of the haptic feedback device. The haptic feedback device also includes a user interface device, and a transducer configured to impart haptic force to the user interface device in response to the composite signal. A tactile mapping submodule, a duration mapping submodule, and an attack/decay mapping submodule may also be included. The tactile mapping submodule enables compensation for haptic output at different positions on the haptic feedback device, whereas the duration and attack/decay submodules enable prevention of unwanted audio output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.