Printed wiring board feed-through capacitor
US8325461B2 · kind B2 · utility
0Cited by
14References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2008 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Oct 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.