Heat insulation structure and image forming apparatus using the same
US8326172B2 · kind B2 · utility
0Cited by
1References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2010 |
| Grant date | Dec 4, 2012 |
| Priority date | — |
| Expiry date | Jan 5, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/2032
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat insulation structure includes: a duct member disposed above a fixing device that fixes developer onto a recording medium, through which air flows to be exhausted; a heat insulating member disposed between an upper side of the duct member and a lower side of a function member disposed above the duct member; and a gap forming member that forms a gap between the duct member and the heat insulation member in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.