Child-resistant carded blister package and method of manufucture
US8328018B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Dec 17, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2215/00
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A carded package includes a front card bonded to a rear card with a blister card captured therebetween. The blister card has upstanding blister compartments projecting through openings of the front card. The rear card extends over an opposite face of the blister card and is a laminate including a tear-resistant polymeric layer bonded to a paperboard layer. The polymeric layer extends adjacent the blister card and the paperboard layer of the laminate extends remote from the blister card forming an exposed surface of the rear card. The rear card includes perforations aligned behind the blister compartments. The perforations include a first set of perforations cut entirely through the paperboard and polymeric layers and a second set of perforations cut into the paperboard layer and not into or entirely through the polymeric layer. A method of assembling a carded package is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.