Methods for manufacturing thin film transistor array substrate and display panel
US8329518B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2011 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0231
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides methods for manufacturing a thin film transistor (TFT) array substrate and a display panel. The method for manufacturing the TFT array substrate comprises the following steps: forming a plurality of gate electrodes, a gate insulating layer, a semiconductor layer, an ohmic contact layer, an electrode layer and a first photo-resist layer on a transparent substrate in sequence; patterning the first photo-resist layer; etching the ohmic contact layer and the electrode layer; coating a second photo-resist layer on the patterned first photo-resist layer and in the channels; removing the second photo-resist layer on the patterned first photo-resist layer and to allow the second photo-resist layer in the channels to remain therein; etching the semiconductor layer; removing the patterned first photo-resist layer and the second photo-resist layer; forming a passivation layer on the channels, the source electrodes and the drain electrodes; and forming a pixel electrode layer on the passivation layer. The present invention can reduce an amount of the required masks in the fabrication process, and only one wet etching is required to etch the metal material on the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.