Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US8329590B2 · kind B2 · utility
5Cited by
20References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Nov 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for shielding a feature projecting from a first area on a substrate to a plasma while simultaneously removing extraneous material from a different area on the substrate with the plasma. The apparatus includes at least one concavity positioned and dimensioned to receive the feature such that the feature is shielded from the plasma. The apparatus further includes a window through which the plasma removes the extraneous material. The method generally includes removing the extraneous material while shielding the feature against plasma exposure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.