Organic silicon compound and material for forming silica-based fine particle
US8329849B2 · kind B2 · utility
4Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2009 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jun 13, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2004/64
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
An organic silicon compound includes a specific alkoxyorganopolysiloxane portion, a portion including an alkoxysilane group, the portion being bonded to the polysiloxane portion, and a portion including a resin-compatible chain or a reactive functional group, the portion being bonded to the polysiloxane portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.